MIS-20038/21: MICROCIRCUIT,LINEAR.
The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.174 INCHES MAXIMUM IN, body_height: 1.495 INCHES MINIMUM AND 1.535 INCHES MAXIMUM IN, body_length: 1.145 INCHES NOMINAL IN, features_provided: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND HYBRID, inclosure_material: CERAMIC AND GLASS, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-200-9520, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.174 INCHES MAXIMUM IN |
| body_height | 1.495 INCHES MINIMUM AND 1.535 INCHES MAXIMUM IN |
| body_length | 1.145 INCHES NOMINAL IN |
| features_provided | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND HYBRID |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 2 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | TIN |
| case_outline_source_and_designator | F-1 MIL-M-38510 |
| NSN | 5962-01-200-9520 |
| INPUT CIRCUIT PATTERN | 2 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | TIN |
| BODY WIDTH | 0.174 INCHES MAXIMUM IN |
| BODY HEIGHT | 1.495 INCHES MINIMUM AND 1.535 INCHES MAXIMUM IN |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND HYBRID |
| INCLOSURE CONFIGURATION | FLAT PACK |
| CASE OUTLINE SOURCE AND DESIGNATOR | F-1 MIL-M-38510 |
| BODY LENGTH | 1.145 INCHES NOMINAL IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
No substitute or cross-reference records for this part.