MILS19500-358: SEMICONDUCTOR DEVICE,DIODE.
The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_height: 0.450 INCHES MAXIMUM IN, overall_length: 1.000 INCHES MAXIMUM IN, mounting_method: THREADED STUD(S), terminal_length: 14.0 MILLIMETERS MAXIMUM MM, overall_diameter: 0.375 INCHES MAXIMUM IN. This part is cataloged in the U.S.
Government catalog under NSN 5961-00-006-7024, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_height | 0.450 INCHES MAXIMUM IN |
| overall_length | 1.000 INCHES MAXIMUM IN |
| mounting_method | THREADED STUD(S) |
| terminal_length | 14.0 MILLIMETERS MAXIMUM MM |
| overall_diameter | 0.375 INCHES MAXIMUM IN |
| features_provided | QUALITY ASSURANCE LEVEL TX AND BURN IN AND HERMETICALLY SEALED CASE AND REVERSE POLARITY |
| nominal_thread_size | 0.250 INCHES IN |
| end_item_identification | CONTROL-INTER E/I FSCM 26401 |
| thread_series_designator | UNF |
| mounting_facility_quantity | 1 |
| overall_width_across_flats | 0.687 INCHES MAXIMUM IN |
| NSN | 5961-00-006-7024 |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 210.0 MAXIMUM BREAKDOWN VOLTAGE, DC |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 CELSIUS CASE DEGC |
| MOUNTING FACILITY QUANTITY | 1 |
| OVERALL DIAMETER | 0.667 INCHES MAXIMUM IN |
| MOUNTING METHOD | THREADED STUD(S) |
| OVERALL LENGTH | 0.450 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| OVERALL WIDTH ACROSS FLATS | 0.667 INCHES MINIMUM AND 0.687 INCHES MAXIMUM IN |
| NOMINAL THREAD SIZE | 0.250 INCHES IN |
| CURRENT RATING PER CHARACTERISTIC | 240.00 MILLIAMPERES MAXIMUM MAXIMUM REVERSE SURGE CURRENT |