The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE, overall_length: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES MINIMUM AND 1.500 INCHES MAXIMUM IN, overall_diameter: 0.092 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-106-1613, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | GLASS ENCLOSURE |
| overall_length | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES MINIMUM AND 1.500 INCHES MAXIMUM IN |
| overall_diameter | 0.092 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| specification/standard_data | 81349-MIL-S-19500/119 GOVERNMENT SPECIFICATION |
| power_rating_per_characteristic | 80.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| current_rating_per_characteristic | 90.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC |
| voltage_rating_in_volts_per_characteristic | -80.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS |
| maximum_operating_temp_per_measurement_point | 75.0 CELSIUS AMBIENT AIR DEGC |
| NSN | 5961-00-106-1613 |
| MATERIAL | GLASS ENCLOSURE |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 75.0 CELSIUS AMBIENT AIR DEGC |
| CURRENT RATING PER CHARACTERISTIC | 1.00 AMPERES MAXIMUM FORWARD CURRENT, DC |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| TERMINAL LENGTH | 1.000 INCHES MINIMUM IN |
| OVERALL DIAMETER | 0.107 INCHES MAXIMUM IN |
| MOUNTING METHOD | TERMINAL |
| OVERALL LENGTH | 0.300 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MATERIAL | GERMANIUM SEMICONDUCTOR |