The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include overall_width: 0.700 INCHES MAXIMUM IN, overall_height: 0.340 INCHES MAXIMUM IN, overall_length: 1.252 INCHES MAXIMUM IN, transfer_ratio: 160.0 MAXIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER, mounting_method: UNTHREADED HOLE(S), overall_diameter: 0.620 INCHES MAXIMUM IN. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-01-069-9732, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| overall_width | 0.700 INCHES MAXIMUM IN |
| overall_height | 0.340 INCHES MAXIMUM IN |
| overall_length | 1.252 INCHES MAXIMUM IN |
| transfer_ratio | 160.0 MAXIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER |
| mounting_method | UNTHREADED HOLE(S) |
| overall_diameter | 0.620 INCHES MAXIMUM IN |
| special_features | JUNCTION PATTERN ARRANGEMENT: NPN |
| features_provided | HERMETICALLY SEALED CASE AND QUALITY ASSURANCE LEVEL TXV |
| internal_configuration | JUNCTION CONTACT |
| semiconductor_material | SILICON |
| mounting_facility_quantity | 2 |
| terminal_type_and_quantity | 2 PIN AND 1 CASE |
| NSN | 5961-01-069-9732 |
| MOUNTING METHOD | UNTHREADED HOLE(S) |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 CELSIUS AMBIENT AIR DEGC |
| MOUNTING FACILITY QUANTITY | 2 |
| TERMINAL TYPE AND QUANTITY | 1 CASE AND 2 PIN |
| CURRENT RATING PER CHARACTERISTIC | 2.00 AMPERES MAXIMUM BASE CURRENT, DC AND 4.00 AMPERES MAXIMUM COLLECTOR CURRENT, DC |
| SPECIFICATION/STANDARD DATA | 81349-MIL-S-19500/518 GOVERNMENT SPECIFICATION |
| SEMICONDUCTOR MATERIAL | SILICON |
| POWER RATING PER CHARACTERISTIC | 25.0 WATTS MAXIMUM TOTAL POWER DISSIPATION |
| ELECTRODE INTERNALLY-ELECTRICALLY CONNECTED TO CASE | COLLECTOR |