The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE, overall_length: 0.230 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES MINIMUM AND 1.500 INCHES MAXIMUM IN, overall_diameter: 0.085 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN, special_features: ITEM HAS METALLURGICAL BOND; UNLEADED OR SUFACE MOUNTED (ROUND END-CAP DIODE). This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-082-3273, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | GLASS ENCLOSURE |
| overall_length | 0.230 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES MINIMUM AND 1.500 INCHES MAXIMUM IN |
| overall_diameter | 0.085 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN |
| special_features | ITEM HAS METALLURGICAL BOND; UNLEADED OR SUFACE MOUNTED (ROUND END-CAP DIODE) |
| features_provided | HERMETICALLY SEALED CASE |
| nominal_thread_size | 0.250 INCHES IN |
| internal_configuration | JUNCTION CONTACT |
| semiconductor_material | SILICON |
| end_item_identification | 5999-01-529-7076; CCA, BIT, AIRCRAFT. MA |
| terminal_circle_diameter | 0.200 INCHES NOMINAL IN |
| NSN | 5961-00-082-3273 |
| INTERNAL CONFIGURATION | JUNCTION CONTACT |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |
| SPECIFICATION/STANDARD DATA | 80131-2N329AM PROFESSIONAL/INDUSTRIAL ASSOCIATION STANDARD |
| INTERNAL JUNCTION CONFIGURATION | PNP |
| SEMICONDUCTOR MATERIAL | SILICON |