MF28F010-25/B: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.404 INCHES MINIMUM AND 0.416 INCHES MAXIMUM IN, body_height: 0.132 INCHES MAXIMUM IN, body_length: 0.810 INCHES MINIMUM AND 0.830 INCHES MAXIMUM IN, features_provided: PROGRAMMABLE AND MONOLITHIC AND W/ENABLE AND W/DISABLE AND HIGH IMPEDANCE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-381-9479, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.404 INCHES MINIMUM AND 0.416 INCHES MAXIMUM IN |
| body_height | 0.132 INCHES MAXIMUM IN |
| body_length | 0.810 INCHES MINIMUM AND 0.830 INCHES MAXIMUM IN |
| features_provided | PROGRAMMABLE AND MONOLITHIC AND W/ENABLE AND W/DISABLE AND HIGH IMPEDANCE |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | EEPROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 28 INPUT |
| inclosure_configuration | FLAT PACK |
| NSN | 5962-01-381-9479 |
| INPUT CIRCUIT PATTERN | 28 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.404 INCHES MINIMUM AND 0.416 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.132 INCHES MAXIMUM IN |
| CAPITANCE RATING PER CHARACTERISTIC | 10.00 INPUT PICOFARADS MAXIMUM AND 12.00 OUTPUT PICOFARADS MAXIMUM |
| FEATURES PROVIDED | PROGRAMMABLE AND MONOLITHIC AND W/ENABLE AND W/DISABLE AND HIGH IMPEDANCE |
| INCLOSURE CONFIGURATION | FLAT PACK |
| CURRENT RATING PER CHARACTERISTIC | 10.00 MICROAMPERES MAXIMUM STAND-BY |
| MEMORY DEVICE TYPE | EEPROM |