MEM855F — SEMICONDUCTOR DEVICES,UNITIZED

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

MEM855F: SEMICONDUCTOR DEVICES,UNITIZED.

The SEMICONDUCTOR DEVICES,UNITIZED is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN, body_height: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN, body_length: 0.360 INCHES MINIMUM AND 0.410 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS, inclosure_material: CERAMIC AND GLASS, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-00-734-6289, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

MEM855F

NSN: 5962-00-734-6289
FSC: 5962 — Microcircuits, Electronic
CAGE: 14936 — GENERAL SEMICONDUCTOR INC (USA)

SPECIFICATIONS

body_width	0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
body_height	0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
body_length	0.360 INCHES MINIMUM AND 0.410 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS
inclosure_material	CERAMIC AND GLASS
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	6 CHANNEL
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	14 FLAT LEADS
design_function_and_quantity	1 MULTIPLEXER, ANALOG
NSN	5962-00-734-6289

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 6 CHANNEL

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 MULTIPLEXER, ANALOG

•

BODY WIDTH: 0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS

•

INCLOSURE CONFIGURATION: FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	6 CHANNEL
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 MULTIPLEXER, ANALOG
BODY WIDTH	0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
BODY HEIGHT	0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS
INCLOSURE CONFIGURATION	FLAT PACK
CASE OUTLINE SOURCE AND DESIGNATOR	T0-87 JOINT ELECTRON DEVICE ENGINEERING COUNCIL
BODY LENGTH	0.360 INCHES MINIMUM AND 0.410 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 7

0073-551P1Reference document

Same NSN cross-reference

Reference document — Secondary reference

MEM2009Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

MX02DReference document

Same NSN cross-reference

Reference document — Secondary reference

MEM2009DLReference document

Same NSN cross-reference

Reference document — Secondary reference

SCA4-33988Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

UC6410FReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusCancelled· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is MEM855F?

MEM855F is a SEMICONDUCTOR DEVICES,UNITIZED.

What parts can replace MEM855F?

There are 7 known substitutes for MEM855F: 0073-551P1, MEM2009, MX02D and 4 more. Substitute compatibility should be verified for your specific system.

What is the NSN for MEM855F?

MEM855F is cataloged in the U.S. Government catalog under NSN 5962-00-734-6289. This indicates validated use in U.S. government and defense supply chains.

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MEM855F — SEMICONDUCTOR DEVICES,UNITIZED

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