MD8749H/B — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

MD8749H/B: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 2.030 INCHES MINIMUM AND 2.080 INCHES MAXIMUM IN, features_provided: HIGH PERFORMANCE AND ULTRAVIOLET ERASABLE AND W/RESET AND PROGRAMMABLE, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-247-5649, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

MD8749H/B

NSN: 5962-01-247-5649
NIINs: 012475649, 012554429, 012584827
FSC: 5962 — Microcircuits, Electronic
CAGE: 34649 — INTEL CORP SALES OFFICE (USA)

SPECIFICATIONS

body_width	0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height	0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length	2.030 INCHES MINIMUM AND 2.080 INCHES MAXIMUM IN
features_provided	HIGH PERFORMANCE AND ULTRAVIOLET ERASABLE AND W/RESET AND PROGRAMMABLE
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	33 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-247-5649

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 33 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 MICROCOMPUTER

•

BODY WIDTH: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND W/RESET AND BIDIRECTIONAL

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	33 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 MICROCOMPUTER
BODY WIDTH	0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
BODY HEIGHT	0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND W/RESET AND BIDIRECTIONAL
INCLOSURE CONFIGURATION	DUAL-IN-LINE
BODY LENGTH	2.030 INCHES MINIMUM AND 2.080 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

26401-0846Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is MD8749H/B?

MD8749H/B is a MICROCIRCUIT,DIGITAL.

What parts can replace MD8749H/B?

There are 2 known substitutes for MD8749H/B: 26401-0846, ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for MD8749H/B?

MD8749H/B is cataloged in the U.S. Government catalog under NSN 5962-01-247-5649. This indicates validated use in U.S. government and defense supply chains.

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