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Technical Data Sheet

MD8155/B — MICROCIRCUIT,DIGITAL

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

MD8155/B: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 2.030 INCHES MINIMUM AND 2.080 INCHES MAXIMUM IN, bit_quantity: 2048, word_quantity: 256, features_provided: HIGH PERFORMANCE AND W/ENABLE AND W/RESET AND HERMETICALLY SEALED. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-115-2831, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
MD8155/B
NSN: 5962-01-115-2831
NIINs: 011152831, 012280135
FSC: 5962 — Microcircuits, Electronic
CAGE: 34649 — INTEL CORP SALES OFFICE (USA)
SPECIFICATIONS
body_width0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length2.030 INCHES MINIMUM AND 2.080 INCHES MAXIMUM IN
bit_quantity2048
word_quantity256
features_providedHIGH PERFORMANCE AND W/ENABLE AND W/RESET AND HERMETICALLY SEALED
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
NSN5962-01-115-2831
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN MD8155/B MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 7 INPUT
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
BODY WIDTH: 0.510 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.165 INCHES MINIMUM AND 0.205 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND RESETTABLE AND W/ENABLE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
CASE OUTLINE SOURCE AND DESIGNATOR: D-5 MIL-M-38510
•
BODY LENGTH: 2.096 INCHES MAXIMUM IN
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN7 INPUT
INCLOSURE MATERIALCERAMIC AND GLASS
BODY WIDTH0.510 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN
BODY HEIGHT0.165 INCHES MINIMUM AND 0.205 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND RESETTABLE AND W/ENABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
CASE OUTLINE SOURCE AND DESIGNATORD-5 MIL-M-38510
BODY LENGTH2.096 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORMMETAL OXIDE-SEMICONDUCTOR LOGIC
SUBSTITUTES & CROSS-REFERENCES 7
839415-19Reference document
Same NSN cross-reference
Reference document — Secondary reference
MD8155H/BReference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
934A059-2Reference document
Same NSN cross-reference
Reference document — Secondary reference
8155/BQAReference document
Same NSN cross-reference
Reference document — Secondary reference
839415-0019Reference document
Same NSN cross-reference
Reference document — Design control — primary reference
ND8155H/BReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is MD8155/B?
MD8155/B is a MICROCIRCUIT,DIGITAL.
What parts can replace MD8155/B?
There are 7 known substitutes for MD8155/B: 839415-19, MD8155H/B, 934A059-2 and 4 more. Substitute compatibility should be verified for your specific system.
What is the NSN for MD8155/B?
MD8155/B is cataloged in the U.S. Government catalog under NSN 5962-01-115-2831. This indicates validated use in U.S. government and defense supply chains.
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