MD8031AH/B: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.600 INCHES MAXIMUM IN, body_height: 0.175 INCHES MAXIMUM IN, body_length: 2.080 INCHES MAXIMUM IN, special_features: NUCLEAR HARDNESS CRITICAL ITEMS, features_provided: HERMETICALLY SEALED AND BURN IN AND HIGH PERFORMANCE AND BIDIRECTIONAL, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-233-1260, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.600 INCHES MAXIMUM IN |
| body_height | 0.175 INCHES MAXIMUM IN |
| body_length | 2.080 INCHES MAXIMUM IN |
| special_features | NUCLEAR HARDNESS CRITICAL ITEMS |
| features_provided | HERMETICALLY SEALED AND BURN IN AND HIGH PERFORMANCE AND BIDIRECTIONAL |
| output_logic_form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 34 INPUT |
| end_item_identification | UGC-129 |
| inclosure_configuration | DUAL-IN-LINE |
| NSN | 5962-01-233-1260 |
| INPUT CIRCUIT PATTERN | 34 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 MICROCOMPUTER |
| BODY WIDTH | 0.600 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.175 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND HIGH PERFORMANCE AND BIDIRECTIONAL |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY LENGTH | 2.080 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |