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Technical Data Sheet
MD747819-24 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND PROGRAMMED AND ULTRAVIOLET ERASABLE AND HERMETICALLY SEALED, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-209-4265, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
MD747819-24
NSN: 5962-01-209-4265
FSC: 5962
CAGE: 35351 — GE AVIATION SYSTEMS LLC (USA)
SPECIFICATIONS
body_width0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN
features_providedELECTROSTATIC SENSITIVE AND PROGRAMMED AND ULTRAVIOLET ERASABLE AND HERMETICALLY SEALED
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern14 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-209-4265
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN MD747819-24 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
INPUT CIRCUIT PATTERN: 14 INPUT
BODY WIDTH: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.3 VOLTS MINIMUM POWER SOURCE AND 22.0 VOLTS MAXIMUM POWER SOURCE
MEMORY DEVICE TYPE: ROM
TERMINAL SURFACE TREATMENT: SOLDER
BODY LENGTH: 1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
TECHNICAL CHARACTERISTICS (FLIS)
INPUT CIRCUIT PATTERN14 INPUT
BODY WIDTH0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.3 VOLTS MINIMUM POWER SOURCE AND 22.0 VOLTS MAXIMUM POWER SOURCE
MEMORY DEVICE TYPEROM
TERMINAL SURFACE TREATMENTSOLDER
BODY LENGTH1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORMN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
BODY HEIGHT0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
VERIFIED SUBSTITUTES & CROSS-REFERENCES 10
24634-0317Interchangeable
interchangeable cross-reference
interchangeable
AM2732DLBInterchangeable
interchangeable cross-reference
interchangeable
3596467-1Interchangeable
interchangeable cross-reference
interchangeable
MD2732A-45Interchangeable
interchangeable cross-reference
interchangeable
MD747819-21Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is MD747819-24?
MD747819-24 is a MICROCIRCUIT,DIGITAL.
What parts can replace MD747819-24?
There are 10 known substitutes for MD747819-24: 24634-0317, AM2732DLB, 3596467-1 and 7 more. Substitute compatibility should be verified for your specific system.
What is the NSN for MD747819-24?
MD747819-24 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-209-4265. This indicates validated use in U.S. government and defense supply chains.
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