MD2764A-35/B — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

MD2764A-35/B: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 12.70 MILLIMETERS MINIMUM AND 15.49 MILLIMETERS MAXIMUM MM, body_height: 4.4 MILLIMETERS MAXIMUM MM, body_length: 37.85 MILLIMETERS MAXIMUM MM, features_provided: HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND HIGH SPEED, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-177-2208, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

MD2764A-35/B

NSN: 5962-01-177-2208
NIINs: 011772208, 012563194
FSC: 5962 — Microcircuits, Electronic
CAGE: 34649 — INTEL CORP SALES OFFICE (USA)

SPECIFICATIONS

body_width	12.70 MILLIMETERS MINIMUM AND 15.49 MILLIMETERS MAXIMUM MM
body_height	4.4 MILLIMETERS MAXIMUM MM
body_length	37.85 MILLIMETERS MAXIMUM MM
features_provided	HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND HIGH SPEED
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-177-2208

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 16 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.625 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.217 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND HIGH SPEED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	16 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.625 INCHES MAXIMUM IN
BODY HEIGHT	0.217 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND HIGH SPEED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.485 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

8200503YAReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM FAMILY 039Reference document

Same NSN cross-reference

Reference document — Secondary reference

148990Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is MD2764A-35/B?

MD2764A-35/B is a MICROCIRCUIT,MEMORY.

What parts can replace MD2764A-35/B?

There are 3 known substitutes for MD2764A-35/B: 8200503YA, ROM/PROM FAMILY 039, 148990. Substitute compatibility should be verified for your specific system.

What is the NSN for MD2764A-35/B?

MD2764A-35/B is cataloged in the U.S. Government catalog under NSN 5962-01-177-2208. This indicates validated use in U.S. government and defense supply chains.

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