MD2716M — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

MD2716M: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN, bit_quantity: 16384, word_quantity: 2048, memory_capacity: UNKNOWN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-107-1082, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

MD2716M

NSN: 5962-01-107-1082
NIINs: 011071082, 012639879, 012639880, 013226662
FSC: 5962 — Microcircuits, Electronic
CAGE: 34649 — INTEL CORP SALES OFFICE (USA)

SPECIFICATIONS

body_width	0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height	0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length	1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN
bit_quantity	16384
word_quantity	2048
memory_capacity	UNKNOWN
features_provided	BURN IN AND ELECTROSTATIC SENSITIVE AND ERASABLE AND PROGRAMMED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-107-1082

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 13 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	13 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
BODY HEIGHT	0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 8

MD2716Reference document

Same NSN cross-reference

Reference document — Secondary reference

3310-0402Reference document

Same NSN cross-reference

Reference document — Secondary reference

810AS829Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

I25-0011-000Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

722930-7Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

14044052-1Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusCancelled· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is MD2716M?

MD2716M is a MICROCIRCUIT,DIGITAL.

What parts can replace MD2716M?

There are 8 known substitutes for MD2716M: MD2716, 3310-0402, 810AS829 and 5 more. Substitute compatibility should be verified for your specific system.

What is the NSN for MD2716M?

MD2716M is cataloged in the U.S. Government catalog under NSN 5962-01-107-1082. This indicates validated use in U.S. government and defense supply chains.

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