MD2102A-4/B — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.275 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.080 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN, body_length: 0.780 INCHES MINIMUM AND 0.820 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND 3-STATE OUTPUT, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System under NSN 5962-01-044-4127, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

MD2102A-4/B

NSN: 5962-01-044-4127
FSC: 5962
CAGE: 34649 — INTEL CORP SALES OFFICE (USA)

SPECIFICATIONS

body_width	0.275 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.080 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN
body_length	0.780 INCHES MINIMUM AND 0.820 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND 3-STATE OUTPUT
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	13 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-044-4127

COMPONENT DIAGRAM

KEY FEATURES

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INPUT CIRCUIT PATTERN: 13 INPUT

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OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC

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OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

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TERMINAL SURFACE TREATMENT: SOLDER

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TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT

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MEMORY DEVICE TYPE: ROM

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STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	13 INPUT
OUTPUT LOGIC FORM	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL SURFACE TREATMENT	SOLDER
TERMINAL TYPE AND QUANTITY	16 PRINTED CIRCUIT
MEMORY DEVICE TYPE	ROM
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
BODY HEIGHT	0.080 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN
MAXIMUM POWER DISSIPATION RATING	1.0 WATTS

VERIFIED SUBSTITUTES & CROSS-REFERENCES 9

21022DMInterchangeableGOVERNMENT REGISTRY