MCM6665BP20 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

MCM6665BP20: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.295 INCHES NOMINAL IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND LOW POWER AND HIGH SPEED AND HIGH PERFORMANCE, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-133-1276, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

MCM6665BP20

NSN: 5962-01-133-1276
FSC: 5962 — Microcircuits, Electronic
CAGE: 04713 — FREESCALE SEMICONDUCTOR, INC. (USA)

SPECIFICATIONS

body_width	0.295 INCHES NOMINAL IN
body_height	0.180 INCHES MAXIMUM IN
body_length	0.840 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND LOW POWER AND HIGH SPEED AND HIGH PERFORMANCE
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
end_item_identification	AN/APY-1 08783
NSN	5962-01-133-1276

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 12 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.295 INCHES NOMINAL IN

•

BODY HEIGHT: 0.180 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND LOW POWER AND HIGH SPEED AND HIGH PERFORMANCE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	12 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.295 INCHES NOMINAL IN
BODY HEIGHT	0.180 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND LOW POWER AND HIGH SPEED AND HIGH PERFORMANCE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	0.840 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 4

SM4164-20JDLReference document

Same NSN cross-reference

Reference document — Secondary reference

01-50064-20Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

TMS4164-20JDLReference document

Same NSN cross-reference

Reference document — Secondary reference

MCM6665AL20Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — mutilation

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FREQUENTLY ASKED QUESTIONS

What is MCM6665BP20?

MCM6665BP20 is a MICROCIRCUIT,MEMORY.

What parts can replace MCM6665BP20?

There are 4 known substitutes for MCM6665BP20: SM4164-20JDL, 01-50064-20, TMS4164-20JDL and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for MCM6665BP20?

MCM6665BP20 is cataloged in the U.S. Government catalog under NSN 5962-01-133-1276. This indicates validated use in U.S. government and defense supply chains.

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