The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.190 INCHES MINIMUM AND 0.220 INCHES MAXIMUM IN, body_length: 0.785 INCHES MAXIMUM IN, overall_height: 0.350 INCHES NOMINAL IN, features_provided: LOW NOISE AND W/RESISTOR AND MONOLITHIC, output_logic_form: DIODE-TRANSISTOR LOGIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-222-3388, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| body_height | 0.190 INCHES MINIMUM AND 0.220 INCHES MAXIMUM IN |
| body_length | 0.785 INCHES MAXIMUM IN |
| overall_height | 0.350 INCHES NOMINAL IN |
| features_provided | LOW NOISE AND W/RESISTOR AND MONOLITHIC |
| output_logic_form | DIODE-TRANSISTOR LOGIC |
| inclosure_material | PLASTIC |
| storage_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| operating_temp_range | +0.0 TO 75.0 CELSIUS DEGC |
| input_circuit_pattern | TRIPLE 3 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-00-222-3388 |
| CASE OUTLINE SOURCE AND DESIGNATOR | T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| OUTPUT LOGIC FORM | DIODE-TRANSISTOR LOGIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| BODY LENGTH | 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 125.0 CELSIUS DEGC |
| OPERATING TEMP RANGE | +0.0 TO 75.0 CELSIUS DEGC |
| MAXIMUM POWER DISSIPATION RATING | 88.5 MILLIWATTS |