MC556F: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.160 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_height: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN, body_length: 0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN, special_features: 0.070 IN. THK IN, features_provided: MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND SYNCHRONOUS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC.
This part is cataloged in the U.S. Government catalog under NSN 5962-00-454-6246, indicating validated use in U.S. government and defense logistics supply chains.
Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.160 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| body_height | 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN |
| body_length | 0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN |
| special_features | 0.070 IN. THK IN |
| features_provided | MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND SYNCHRONOUS |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 8 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-00-454-6246 |
| INCLOSURE MATERIAL | CERAMIC |
| DESIGN FUNCTION AND QUANTITY | 1 GATE, NAND |
| BODY WIDTH | 0.260 INCHES NOMINAL IN |
| FEATURES PROVIDED | HERMETICALLY SEALED |
| INCLOSURE CONFIGURATION | FLAT PACK |
| BODY LENGTH | 0.260 INCHES NOMINAL IN |
| SPECIAL FEATURES | 0.070 IN. THK IN |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |