The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.290 INCHES MAXIMUM IN, body_height: 0.235 INCHES MAXIMUM IN, body_length: 0.995 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND 3-STATE OUTPUT AND HIGH SPEED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-202-0519, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.290 INCHES MAXIMUM IN |
| body_height | 0.235 INCHES MAXIMUM IN |
| body_length | 0.995 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC AND 3-STATE OUTPUT AND HIGH SPEED |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | OCTAL 1 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 20 PRINTED CIRCUIT |
| NSN | 5962-01-202-0519 |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 8 BUFFER, TRI-STATE |
| BODY HEIGHT | 0.235 INCHES MAXIMUM IN |
| INPUT CIRCUIT PATTERN | OCTAL 1 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
| BODY WIDTH | 0.290 INCHES MAXIMUM IN |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |