The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.600 INCHES MAXIMUM IN, body_height: 0.200 INCHES MAXIMUM IN, body_length: 1.320 INCHES MAXIMUM IN, overall_width: 0.650 INCHES MAXIMUM IN, overall_height: 0.370 INCHES MAXIMUM IN, overall_length: 1.300 INCHES MAXIMUM IN. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-078-0470, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.600 INCHES MAXIMUM IN |
| body_height | 0.200 INCHES MAXIMUM IN |
| body_length | 1.320 INCHES MAXIMUM IN |
| overall_width | 0.650 INCHES MAXIMUM IN |
| overall_height | 0.370 INCHES MAXIMUM IN |
| overall_length | 1.300 INCHES MAXIMUM IN |
| features_provided | BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED |
| output_logic_form | METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 125.0 CELSIUS DEGC |
| operating_temp_range | -25.0 TO 85.0 CELSIUS DEGC |
| NSN | 5962-01-078-0470 |
| OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| BODY LENGTH | 1.290 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND EDGE TRIGGERED AND PROGRAMMABLE AND W/ENABLE AND 3-STATE OUTPUT |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INPUT CIRCUIT PATTERN | 9 INPUT |
| OPERATING TEMP RANGE | -55.0 TO 110.0 CELSIUS DEGC |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| MEMORY DEVICE TYPE | ROM |
| STORAGE TEMP RANGE | -65.0 TO 125.0 CELSIUS DEGC |
| MAXIMUM POWER DISSIPATION RATING | 1.8 WATTS |