The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.250 INCHES NOMINAL IN, body_height: 0.200 INCHES MAXIMUM IN, body_length: 0.870 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: PLASTIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-214-1606, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.250 INCHES NOMINAL IN |
| body_height | 0.200 INCHES MAXIMUM IN |
| body_length | 0.870 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | PLASTIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -40.0 TO 85.0 CELSIUS DEGC |
| input_circuit_pattern | 6 INPUT |
| inclosure_configuration | FLAT PACK |
| design_function_and_quantity | 6 BUFFER AND 6 CONVERTER |
| maximum_power_dissipation_rating | 200.0 MILLIWATTS |
| NSN | 5962-00-214-1606 |
| DESIGN FUNCTION AND QUANTITY | 6 BUFFER, INVERTING AND 6 CONVERTER, LOGIC LEVEL |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY WIDTH | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN |
| INPUT CIRCUIT PATTERN | HEX 1 INPUT |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CASE OUTLINE SOURCE AND DESIGNATOR | -0-001-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND W/BUFFERED OUTPUT AND LOW POWER AND MEDIUM SPEED AND POSITIVE OUTPUTS |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |