MBM300GR12A: SEMICONDUCTOR DEVICE ASSEMBLY.
The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include overall_width: 80.0 MILLIMETERS NOMINAL MM, overall_height: 36.0 MILLIMETERS NOMINAL MM, overall_length: 110.0 MILLIMETERS NOMINAL MM, major_components: TRANSISTOR AND DIODE, mounting_configuration: 4 6.5MM UNTHREADED HOLES MM, part_name_assigned_by_controlling_agency: IGBT MODULE. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-668-2435, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_width | 80.0 MILLIMETERS NOMINAL MM |
| overall_height | 36.0 MILLIMETERS NOMINAL MM |
| overall_length | 110.0 MILLIMETERS NOMINAL MM |
| major_components | TRANSISTOR AND DIODE |
| mounting_configuration | 4 6.5MM UNTHREADED HOLES MM |
| part_name_assigned_by_controlling_agency | IGBT MODULE |
| NSN | 5961-01-668-2435 |
| OVERALL HEIGHT | 36.0 MILLIMETERS NOMINAL MM |
| MAJOR COMPONENTS | TRANSISTOR AND DIODE |
| OVERALL LENGTH | 110.0 MILLIMETERS NOMINAL MM |
| OVERALL WIDTH | 80.0 MILLIMETERS NOMINAL MM |
| MOUNTING CONFIGURATION | 4 6.5MM UNTHREADED HOLES MM |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | IGBT MODULE |
No substitute or cross-reference records for this part.