Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: MB8168-55

MB8168-55 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: 3-STATE OUTPUT, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: METAL OR CERAMIC OR PLASTIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-262-0193, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

MB8168-55

NSN: 5962-01-262-0193
FSC: 5962
CAGE: 3R731 — FUJITSU AMERICA INC (USA)

SPECIFICATIONS

body_width	0.310 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	1.060 INCHES MAXIMUM IN
features_provided	3-STATE OUTPUT
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	METAL OR CERAMIC OR PLASTIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	20 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-262-0193

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: METAL OR CERAMIC OR PLASTIC

•

TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT

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CASE OUTLINE SOURCE AND DESIGNATOR: D-8 MIL-M-38510

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TERMINAL SURFACE TREATMENT: SOLDER

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MEMORY DEVICE TYPE: RAM

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TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

INCLOSURE MATERIAL	METAL OR CERAMIC OR PLASTIC
TERMINAL TYPE AND QUANTITY	20 PRINTED CIRCUIT
CASE OUTLINE SOURCE AND DESIGNATOR	D-8 MIL-M-38510
TERMINAL SURFACE TREATMENT	SOLDER
MEMORY DEVICE TYPE	RAM
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
BODY HEIGHT	0.185 INCHES MAXIMUM IN
BODY WIDTH	0.310 INCHES MAXIMUM IN

VERIFIED SUBSTITUTES & CROSS-REFERENCES 21

379527C91Interchangeable