The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.360 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN, body_length: 0.640 INCHES MAXIMUM IN, features_provided: PROGRAMMED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-370-1455, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.360 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN |
| body_height | 0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN |
| body_length | 0.640 INCHES MAXIMUM IN |
| features_provided | PROGRAMMED |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 24 FLAT LEADS |
| NSN | 5962-01-370-1455 |
| INCLOSURE CONFIGURATION | FLAT PACK |
| TERMINAL TYPE AND QUANTITY | 24 FLAT LEADS |
| MEMORY DEVICE TYPE | PROM |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE MATERIAL | CERAMIC |
| FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |