MA4P315 — SEMICONDUCTOR DEVICE,DIODE

✓ Government record, cited

— · SFP TRANSCEIVER

PRODUCT OVERVIEW

MA4P315: SEMICONDUCTOR DEVICE,DIODE.

The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.205 INCHES MINIMUM AND 0.225 INCHES MAXIMUM IN, mounting_method: PRESS FIT, overall_diameter: 0.119 INCHES MINIMUM AND 0.127 INCHES MAXIMUM IN, special_features: NUCLEAR HARDNESS CRITICAL ITEM; JUNCTION PATTERN ARRANGEMENT: PIN, features_provided: BURN IN AND HERMETICALLY SEALED CASE AND QUALITY ASSURANCE LEVEL TXV. This part is cataloged in the U.S.

Government catalog under NSN 5961-01-339-6775, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

MA4P315

NSN: 5961-01-339-6775
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 96341 — COBHAM ADVANCED ELECTRONIC SOLUTIONS INC. (USA)

SPECIFICATIONS

material	SILICON SEMICONDUCTOR
overall_length	0.205 INCHES MINIMUM AND 0.225 INCHES MAXIMUM IN
mounting_method	PRESS FIT
overall_diameter	0.119 INCHES MINIMUM AND 0.127 INCHES MAXIMUM IN
special_features	NUCLEAR HARDNESS CRITICAL ITEM; JUNCTION PATTERN ARRANGEMENT: PIN
features_provided	BURN IN AND HERMETICALLY SEALED CASE AND QUALITY ASSURANCE LEVEL TXV
terminal_type_and_quantity	2 FERRULE
criticality_code_justification	FEAT
power_rating_per_characteristic	10.0 WATTS MAXIMUM TOTAL POWER DISSIPATION
maximum_operating_temp_per_measurement_point	175.0 CELSIUS JUNCTION DEGC
NSN	5961-01-339-6775

COMPONENT DIAGRAM

KEY FEATURES

•

MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 175.0 CELSIUS JUNCTION DEGC

•

OVERALL DIAMETER: 0.119 INCHES MINIMUM AND 0.127 INCHES MAXIMUM IN

•

MOUNTING METHOD: PRESS FIT

•

CRITICALITY CODE JUSTIFICATION: FEAT

•

FEATURES PROVIDED: BURN IN AND HERMETICALLY SEALED CASE AND QUALITY ASSURANCE LEVEL TXV

•

MATERIAL: SILICON SEMICONDUCTOR

TECHNICAL CHARACTERISTICS

MAXIMUM OPERATING TEMP PER MEASUREMENT POINT	175.0 CELSIUS JUNCTION DEGC
OVERALL DIAMETER	0.119 INCHES MINIMUM AND 0.127 INCHES MAXIMUM IN
MOUNTING METHOD	PRESS FIT
CRITICALITY CODE JUSTIFICATION	FEAT
OVERALL LENGTH	0.205 INCHES MINIMUM AND 0.225 INCHES MAXIMUM IN
FEATURES PROVIDED	BURN IN AND HERMETICALLY SEALED CASE AND QUALITY ASSURANCE LEVEL TXV
SPECIAL FEATURES	NUCLEAR HARDNESS CRITICAL ITEM; JUNCTION PATTERN ARRANGEMENT: PIN
MATERIAL	SILICON SEMICONDUCTOR
MATERIAL	GLASS ENCLOSURE
TERMINAL TYPE AND QUANTITY	2 FERRULE

OTHER ITEMS IN FSC 5961 — Semiconductor Devices and Associated Hardware

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5961-00-000-0150 5961-00-000-4541 5961-00-000-5400 5961-00-000-7614 5961-00-000-8760 5961-00-001-1352 5961-00-001-2624 5961-00-001-2978

SUBSTITUTES & CROSS-REFERENCES 2

DP101876-301Reference document

Same NSN cross-reference

Reference document — Secondary reference

NH142314-0001Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Normally procured from the manufacturer (OEM)No demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is MA4P315?

MA4P315 is a SEMICONDUCTOR DEVICE,DIODE.

What parts can replace MA4P315?

There are 2 known substitutes for MA4P315: DP101876-301, NH142314-0001. Substitute compatibility should be verified for your specific system.

What is the NSN for MA4P315?

MA4P315 is cataloged in the U.S. Government catalog under NSN 5961-01-339-6775. This indicates validated use in U.S. government and defense supply chains.

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MA4P315 — SEMICONDUCTOR DEVICE,DIODE

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