MA41568: SEMICONDUCTOR DEVICE SET.
The SEMICONDUCTOR DEVICE SET is a the manufacturer industrial component. Key specifications include material: CERAMIC ENCLOSURE ALL SEMICONDUCTOR DEVICE DIODE, overall_length: 0.800 INCHES MINIMUM AND 0.840 INCHES MAXIMUM LOCATION NOT OTHERWISE SPECIFIED IN, mounting_method: PRESS FIT ALL SEMICONDUCTOR DEVICE DIODE, overall_diameter: 0.292 INCHES MINIMUM AND 0.296 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN, component_name_and_quantity: 2 SEMICONDUCTOR DEVICE DIODE, precious_material_and_location: PLATED METAL SURFACES GOLD. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-188-4147, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | CERAMIC ENCLOSURE ALL SEMICONDUCTOR DEVICE DIODE |
| overall_length | 0.800 INCHES MINIMUM AND 0.840 INCHES MAXIMUM LOCATION NOT OTHERWISE SPECIFIED IN |
| mounting_method | PRESS FIT ALL SEMICONDUCTOR DEVICE DIODE |
| overall_diameter | 0.292 INCHES MINIMUM AND 0.296 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN |
| component_name_and_quantity | 2 SEMICONDUCTOR DEVICE DIODE |
| precious_material_and_location | PLATED METAL SURFACES GOLD |
| component_function_relationship | MATCHED |
| maximum_operating_temp_per_measurement_point | 100.0 CELSIUS AMBIENT AIR ALL SEMICONDUCTOR DEVICE DIODE DEGC |
| NSN | 5961-01-188-4147 |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 100.0 CELSIUS AMBIENT AIR ALL SEMICONDUCTOR DEVICE DIODE DEGC |
| OVERALL DIAMETER | 0.292 INCHES MINIMUM AND 0.296 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN |
| COMPONENT FUNCTION RELATIONSHIP | MATCHED |
| MOUNTING METHOD | PRESS FIT ALL SEMICONDUCTOR DEVICE DIODE |
| OVERALL LENGTH | 0.800 INCHES MINIMUM AND 0.840 INCHES MAXIMUM LOCATION NOT OTHERWISE SPECIFIED IN |
| COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
| PRECIOUS MATERIAL AND LOCATION | PLATED METAL SURFACES GOLD |
| MATERIAL | CERAMIC ENCLOSURE ALL SEMICONDUCTOR DEVICE DIODE |