M470T2953EZ3-CE6 — Memory Specs & Substitutes

✓ Verified by PartsTable

SAMSUNG · MEMORY · RDIMM

WHAT YOU NEED TO KNOW

Memory is a hot market right now. DDR5 and DDR4 are extremely volatile with data centers driving availability to extreme lows. Always validate machine type and model. Remember: all RAM is Hynix, Samsung, or Micron underneath OEM labels — use that to find alternatives. Key checks: Check OEM alternatives — all RAM is Hynix/Samsung/Micron underneath. Double-check what you're quoting in volatile market.

HOT market — DDR5/DDR4 extremely volatile

PRODUCT OVERVIEW

Samsung 1GB PC2-5300 667MHZ DDR2 SODIM MEMORY. Key specifications include ECC: No, Component for: Laptop, Memory voltage: 1.8 V, Internal memory: 1 GB, Memory clock speed: 667 MHz, Memory form factor: 200-pin SO-DIMM. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 7025-01-562-1728, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

MEMORY→ RDIMM→ M470T2953EZ3-CE6

NSN: 7025-01-562-1728
FSC: 7025
CAGE: 0H108 — SAMSUNG AMERICA INC (USA)

SPECIFICATIONS

ECC	No
CAS latency	5
Component for	Laptop
Memory ranking	2
Memory voltage	1.8 V
Internal memory	1 GB
Memory clock speed	667 MHz
Memory form factor	200-pin SO-DIMM
Internal memory type	DDR2
Memory layout (modules x size)	1 x 1 GB
NSN	7025-01-562-1728

COMPONENT DIAGRAM

KEY FEATURES

•

Up to 1 GB

•

1GB Capacity

•

FUNCTIONAL DESCRIPTION: RAM MEMORY CHIP SPECIFICATIONS: 1GB, 667MHZ, DDR2-667 PC2-5300, 200P, SODIMM, 1.8V GB

•

VOLTAGE IN VOLTS AND CURRENT TYPE: 1.80 AC/DC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

SPECIAL FEATURES	TYPE IS DDR2 SODIMM; CAPACITY 1GB; SPEED PC5400 667MHZ; SIZE AND BIT IS 128MX64/64MX8; 200 PINS; NO ECC; SAMSUNG CHIP GB
FUNCTIONAL DESCRIPTION	RAM MEMORY CHIP SPECIFICATIONS: 1GB, 667MHZ, DDR2-667 PC2-5300, 200P, SODIMM, 1.8V GB
VOLTAGE IN VOLTS AND CURRENT TYPE	1.80 AC/DC
END ITEM IDENTIFICATION	CF-52 DCCDZBM (0J4G8) TOUGHBOOK 52 LAPTOP
SPECIAL FEATURES	TYPE IS DDR2 SODIMM; CAPACITY 1GB; SPEED PC5400 667MHZ; SIZE AND BIT IS 128MX64/64MX8; 200 PINS; NO ECC; SAMSUNG CHIP GB
FUNCTIONAL DESCRIPTION	RAM MEMORY CHIP SPECIFICATIONS: 1GB, 667MHZ, DDR2-667 PC2-5300, 200P, SODIMM, 1.8V GB
VOLTAGE IN VOLTS AND CURRENT TYPE	1.80 AC/DC
END ITEM IDENTIFICATION	CF-52 DCCDZBM (0J4G8) TOUGHBOOK 52 LAPTOP

VERIFIED SUBSTITUTES & CROSS-REFERENCES 19

KK3921AA1REV-Interchangeable