The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.785 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND LOW POWER AND SCHOTTKY, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: SILICON. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-096-5755, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 0.785 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC AND LOW POWER AND SCHOTTKY |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | SILICON |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | DUAL 2 WIDE 2-3 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| specification/standard_data | 81349-MIL-M-38510/304 GOVERNMENT SPECIFICATION |
| design_function_and_quantity | 2 GATE, AND-OR INVERT |
| NSN | 5962-01-096-5755 |
| INCLOSURE MATERIAL | CERAMIC |
| MAXIMUM POWER DISSIPATION RATING | 15.0 MILLIWATTS |
| FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND LOW POWER AND SCHOTTKY |
| DESIGN FUNCTION AND QUANTITY | 2 GATE, AND-OR INVERT |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-1 MIL-M-38510 |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| BODY WIDTH | 0.250 INCHES NOMINAL IN |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |