M38510/75002B2B — Technical Data Sheet

✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_height: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_length: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System under NSN 5962-01-390-5151, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

M38510/75002B2B

NSN: 5962-01-390-5151
FSC: 5962
CAGE: 81349 — MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M

SPECIFICATIONS

body_width	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
body_height	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
body_length	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
inclosure_configuration	LEADED CHIP CARRIER
terminal_surface_treatment	SOLDER
design_function_and_quantity	3 GATE, NAND
maximum_power_dissipation_rating	500.0 MILLIWATTS
current_rating_per_characteristic	100.00 MILLIAMPERES NOMINAL OUTPUT SINK
case_outline_source_and_designator	C-2 MIL-M-38510
NSN	5962-01-390-5151

COMPONENT DIAGRAM

KEY FEATURES

•

CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES NOMINAL OUTPUT SINK

•

OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC

•

DESIGN FUNCTION AND QUANTITY: 3 GATE, NAND

•

CASE OUTLINE SOURCE AND DESIGNATOR: C-2 MIL-M-38510

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

•

OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

•

TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT

•

BODY WIDTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN

TECHNICAL CHARACTERISTICS

CURRENT RATING PER CHARACTERISTIC	100.00 MILLIAMPERES NOMINAL OUTPUT SINK
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
DESIGN FUNCTION AND QUANTITY	3 GATE, NAND
CASE OUTLINE SOURCE AND DESIGNATOR	C-2 MIL-M-38510
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY	20 PRINTED CIRCUIT
BODY WIDTH	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
TERMINAL SURFACE TREATMENT	SOLDER
MAXIMUM POWER DISSIPATION RATING	500.0 MILLIWATTS

VERIFIED SUBSTITUTES & CROSS-REFERENCES 24

M38510/75001BCBInterchangeableGOVERNMENT REGISTRY