The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_height: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_length: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System under NSN 5962-01-390-5151, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN |
| body_height | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN |
| body_length | 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| end_item_identification | A/F-18-DCN |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 14 FLAT LEADS |
| design_function_and_quantity | 3 GATE, NAND |
| maximum_power_dissipation_rating | 500.0 MILLIWATTS |
| NSN | 5962-01-390-5151 |
| CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES NOMINAL OUTPUT SINK |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| DESIGN FUNCTION AND QUANTITY | 3 GATE, NAND |
| CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
| BODY WIDTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN |
| TERMINAL SURFACE TREATMENT | SOLDER |
| MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |