M38510/65001B2A — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

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PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_height: 0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, features_provided: HIGH SPEED AND MONOLITHIC AND HERMETICALLY SEALED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-264-2977, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

M38510/65001B2A

NSN: 5962-01-264-2977
FSC: 5962
CAGE: 81349 — MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M

SPECIFICATIONS

body_width	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
body_height	0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
features_provided	HIGH SPEED AND MONOLITHIC AND HERMETICALLY SEALED
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	QUAD 2 INPUT
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	20 LEADLESS
NSN	5962-01-264-2977

COMPONENT DIAGRAM

KEY FEATURES

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INCLOSURE MATERIAL: CERAMIC

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BODY LENGTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE

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MAXIMUM POWER DISSIPATION RATING: 300.0 MILLIWATTS

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DESIGN FUNCTION AND QUANTITY: 4 GATE, NAND

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TERMINAL TYPE AND QUANTITY: 20 LEADLESS

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TERMINAL SURFACE TREATMENT: SOLDER

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OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC

TECHNICAL CHARACTERISTICS (FLIS)

INCLOSURE MATERIAL	CERAMIC
BODY LENGTH	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
MAXIMUM POWER DISSIPATION RATING	300.0 MILLIWATTS
DESIGN FUNCTION AND QUANTITY	4 GATE, NAND
TERMINAL TYPE AND QUANTITY	20 LEADLESS
TERMINAL SURFACE TREATMENT	SOLDER
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
TIME RATING PER CHACTERISTIC	20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

VERIFIED SUBSTITUTES & CROSS-REFERENCES 30

UTN0-00002Interchangeable