M38510/21004BKB — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.300 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN, body_length: 0.640 INCHES MAXIMUM IN, inclosure_material: CERAMIC, memory_device_type: PROM, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-375-4964, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

M38510/21004BKB

NSN: 5962-01-375-4964
FSC: 5962
CAGE: 81349 — MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M

SPECIFICATIONS

body_width	0.300 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN
body_height	0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN
body_length	0.640 INCHES MAXIMUM IN
features_provided	PROGRAMMED AND W/ACTIVE PULL-UP AND 3-STATE OUTPUT AND HIGH IMPEDANCE AND SCHOTTKY AND BIPOLAR AND W/ENABLE AND MONOLITHIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-375-4964

COMPONENT DIAGRAM

KEY FEATURES

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INCLOSURE CONFIGURATION: FLAT PACK

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INPUT CIRCUIT PATTERN: 14 INPUT

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INCLOSURE MATERIAL: CERAMIC

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MEMORY DEVICE TYPE: PROM

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CURRENT RATING PER CHARACTERISTIC: 185.00 MILLIAMPERES MAXIMUM SUPPLY

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TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

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TERMINAL SURFACE TREATMENT: SOLDER

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CASE OUTLINE SOURCE AND DESIGNATOR: F-6 MIL-M-38510

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

INCLOSURE CONFIGURATION	FLAT PACK
INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
MEMORY DEVICE TYPE	PROM
CURRENT RATING PER CHARACTERISTIC	185.00 MILLIAMPERES MAXIMUM SUPPLY
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TERMINAL SURFACE TREATMENT	SOLDER
CASE OUTLINE SOURCE AND DESIGNATOR	F-6 MIL-M-38510
TERMINAL TYPE AND QUANTITY	24 FLAT LEADS
TIME RATING PER CHACTERISTIC	55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS

VERIFIED SUBSTITUTES & CROSS-REFERENCES 28

6657345-3Interchangeable