M38510/20802BJX: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.210 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, special_features: TEXT FIELD, EXAMPLE 512 X 8 PROM, features_provided: PROGRAMMED. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-157-9098, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| body_height | 0.210 INCHES MAXIMUM IN |
| body_length | 1.290 INCHES MAXIMUM IN |
| memory_capacity | UNKNOWN |
| special_features | TEXT FIELD, EXAMPLE 512 X 8 PROM |
| features_provided | PROGRAMMED |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| precious_material | GOLD |
| inclosure_material | CERAMIC |
| memory_device_type | PROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| NSN | 5962-01-157-9098 |
| INPUT CIRCUIT PATTERN | 13 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.210 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND SCHOTTKY AND BIPOLAR AND PROGRAMMABLE AND PROGRAMMED AND POSITIVE OUTPUTS |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | ROM |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-3 MIL-M-38510 |
| SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/208/USAF/ GOVERNMENT SPECIFICATION |