PartsTable
Technical Data Sheet

M38510/20404BEB — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

M38510/20404BEB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 0.480 INCHES MAXIMUM IN, features_provided: BURN IN AND HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR AND SCHOTTKY, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-375-3748, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
M38510/20404BEB
NSN: 5962-01-375-3748
FSC: 5962 — Microcircuits, Electronic
CAGE: 81349 — MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length0.480 INCHES MAXIMUM IN
features_providedBURN IN AND HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR AND SCHOTTKY
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern10 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-375-3748
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN M38510/20404BEB MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 10 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
•
FEATURES PROVIDED: BURN IN AND HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR AND SCHOTTKY
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
CURRENT RATING PER CHARACTERISTIC: 140.00 MILLIAMPERES MAXIMUM SUPPLY
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN10 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
FEATURES PROVIDEDBURN IN AND HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR AND SCHOTTKY
INCLOSURE CONFIGURATIONDUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC140.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPEPROM
CASE OUTLINE SOURCE AND DESIGNATORD-2 MIL-M-38510
SUBSTITUTES & CROSS-REFERENCES 7
5962-3820404BEXReference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROM HEAD 190Reference document
Same NSN cross-reference
Reference document — Secondary reference
M38510/20404BEXReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-3820404BEAReference document
Same NSN cross-reference
Reference document — Secondary reference
MIL-M-38510/204Reference document
Same NSN cross-reference
Reference document — Identification reference
5962-3820404BEBReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is M38510/20404BEB?
M38510/20404BEB is a MICROCIRCUIT,MEMORY.
What parts can replace M38510/20404BEB?
There are 7 known substitutes for M38510/20404BEB: 5962-3820404BEX, ROM/PROM HEAD 190, M38510/20404BEX and 4 more. Substitute compatibility should be verified for your specific system.
What is the NSN for M38510/20404BEB?
M38510/20404BEB is cataloged in the U.S. Government catalog under NSN 5962-01-375-3748. This indicates validated use in U.S. government and defense supply chains.
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✓ PartsTable — the parts reference. Every fact cited to its source.
PartsTable Design LLC · partstable.com
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.
PartsTable commercial catalog: edition Unified commercial catalog snapshot through 2026-09-28, edition date not on file, retrieved 2026-09-28.