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Technical Data Sheet

M312L6523CZ3-CB3/CCC — MEMORY UNIT,DATA STORAGE

✓ Government record, cited
SAMSUNG SEMICONDUCTOR, INC. DBA SAMSUNG DIV SAMSUNG SEMICONDUCTOR · NIC ADAPTER
PRODUCT OVERVIEW

M312L6523CZ3-CB3/CCC: MEMORY UNIT,DATA STORAGE.

The MEMORY UNIT,DATA STORAGE is a SAMSUNG SEMICONDUCTOR, INC. DBA SAMSUNG DIV SAMSUNG SEMICONDUCTOR memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include END ITEM IDENTIFICATION: 170-32215(61099), SERVER RUGGED V240, ACCESSORY COMPONENTS AND QUANTITY: MODULE; 1, GENERAL CHARACTERISTICS ITEM DESCRIPTION: DDR SDRAM 1U DIMM MODULES, REGISTERED DENSITY 512MB MB.

This part is cataloged in the U.S. Government catalog under NSN 7025-01-560-2580, indicating validated use in U.S. government and defense logistics supply chains.

Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
M312L6523CZ3-CB3/CCC
NSN: 7025-01-560-2580
FSC: 7025 — Information Technology Input/output and Storage Devices
CAGE: 0DUN9 — SAMSUNG SEMICONDUCTOR, INC. DBA SAMSUNG DIV SAMSUNG SEMICONDUCTOR (USA)
SPECIFICATIONS
END ITEM IDENTIFICATION170-32215(61099), SERVER RUGGED V240
ACCESSORY COMPONENTS AND QUANTITYMODULE; 1
GENERAL CHARACTERISTICS ITEM DESCRIPTIONDDR SDRAM 1U DIMM MODULES, REGISTERED DENSITY 512MB MB
NSN7025-01-560-2580
COMPONENT DIAGRAM
NIC CTRL PHY 0 PHY 1 ROM VRM SFP+ SFP+ LINK ACT PCIe x8 ~167 mm NETWORK ADAPTER | 2-PORT 10GbE | SFP+ | Full Height PCIe x8 | Link/Activity LEDs | PXE boot ROM TITLE NIC ADAPTER PN M312L6523CZ3-CB3/CCC MFR SAMSUNG SEMICONDUCTOR, INC. DBA SAMSUNG DIV SAMSUNG SEMICONDUCTOR MEMORY UNIT,DATA STORAGE
KEY FEATURES
•
GENERAL CHARACTERISTICS ITEM DESCRIPTION: DDR SDRAM 1U DIMM MODULES, REGISTERED DENSITY 512MB MB
•
ACCESSORY COMPONENTS AND QUANTITY: MODULE; 1
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
GENERAL CHARACTERISTICS ITEM DESCRIPTIONDDR SDRAM 1U DIMM MODULES, REGISTERED DENSITY 512MB MB
ACCESSORY COMPONENTS AND QUANTITYMODULE; 1
END ITEM IDENTIFICATION170-32215(61099), SERVER RUGGED V240
SUBSTITUTES & CROSS-REFERENCES 2
X7703A-4Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
370-7972-01Reference document
Same NSN cross-reference
Reference document — Design control — primary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Normally procured from the manufacturer (OEM)Demilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is M312L6523CZ3-CB3/CCC?
M312L6523CZ3-CB3/CCC is a MEMORY UNIT,DATA STORAGE manufactured by SAMSUNG SEMICONDUCTOR, INC. DBA SAMSUNG DIV SAMSUNG SEMICONDUCTOR.
What parts can replace M312L6523CZ3-CB3/CCC?
There are 2 known substitutes for M312L6523CZ3-CB3/CCC: X7703A-4, 370-7972-01. Substitute compatibility should be verified for your specific system.
What is the NSN for M312L6523CZ3-CB3/CCC?
M312L6523CZ3-CB3/CCC is cataloged in the U.S. Government catalog under NSN 7025-01-560-2580. This indicates validated use in U.S. government and defense supply chains.
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