The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.165 INCHES MAXIMUM IN, body_length: 0.996 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED, inclosure_material: CERAMIC AND GLASS, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System under NSN 5962-01-175-8550, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.165 INCHES MAXIMUM IN |
| body_length | 0.996 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| design_function_and_quantity | 8 DRIVER, INVERTING |
| NSN | 5962-01-175-8550 |
| DESIGN FUNCTION AND QUANTITY | 8 DRIVER, INVERTING |
| BODY HEIGHT | 0.165 INCHES MAXIMUM IN |
| BODY LENGTH | 0.996 INCHES MAXIMUM IN |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | FLAT PACK |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| FEATURES PROVIDED | HERMETICALLY SEALED |