M235A330-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

M235A330-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.568 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.040 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, body_length: 1.380 INCHES MINIMUM AND 1.420 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN, inclosure_material: CERAMIC, memory_device_type: ROM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-198-7091, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

M235A330-1

NSN: 5962-01-198-7091
FSC: 5962 — Microcircuits, Electronic
CAGE: 78711 — TELEPHONICS CORP (USA)

SPECIFICATIONS

body_width	0.568 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height	0.040 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
body_length	1.380 INCHES MINIMUM AND 1.420 INCHES MAXIMUM IN
features_provided	ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	25 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
maximum_power_dissipation_rating	460.0 MILLIWATTS
NSN	5962-01-198-7091

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 25 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.568 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.040 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	25 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.568 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
BODY HEIGHT	0.040 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.380 INCHES MINIMUM AND 1.420 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is M235A330-1?

M235A330-1 is a MICROCIRCUIT,MEMORY.

What is the NSN for M235A330-1?

M235A330-1 is cataloged in the U.S. Government catalog under NSN 5962-01-198-7091. This indicates validated use in U.S. government and defense supply chains.

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M235A330-1 — MICROCIRCUIT,MEMORY

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