LT1010CK: MICROCIRCUIT,LINEAR.
The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.465 INCHES NOMINAL IN, body_height: 0.350 INCHES MAXIMUM IN, body_length: 1.197 INCHES NOMINAL IN, features_provided: HIGH SPEED AND MONOLITHIC, inclosure_material: METAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-359-5364, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.465 INCHES NOMINAL IN |
| body_height | 0.350 INCHES MAXIMUM IN |
| body_length | 1.197 INCHES NOMINAL IN |
| features_provided | HIGH SPEED AND MONOLITHIC |
| inclosure_material | METAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | +0.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 1 INPUT |
| inclosure_configuration | CAN |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 4 PIN |
| NSN | 5962-01-359-5364 |
| INPUT CIRCUIT PATTERN | 1 INPUT |
| INCLOSURE MATERIAL | METAL |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 BUFFER |
| BODY WIDTH | 0.465 INCHES NOMINAL IN |
| BODY HEIGHT | 0.350 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HIGH SPEED AND MONOLITHIC |
| INCLOSURE CONFIGURATION | CAN |
| CURRENT RATING PER CHARACTERISTIC | 40.00 MILLIAMPERES MAXIMUM INPUT |
| CASE OUTLINE SOURCE AND DESIGNATOR | TO-3 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |