LMU217RMB75: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, end_item_identification: JOINT STRS RD E/I FSCM 67268, inclosure_configuration: FLAT PACK, terminal_surface_treatment: SOLDER. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-451-4530, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| end_item_identification | JOINT STRS RD E/I FSCM 67268 |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 64 FLAT LEADS |
| design_function_and_quantity | 1 MULTIPLEXER |
| maximum_power_dissipation_rating | 1.2 WATTS |
| part_name_assigned_by_controlling_agency | 16 X 16 MULTIPLEXER |
| voltage_rating_and_type_per_characteristic | 5.0 VOLTS NOMINAL INPUT |
| NSN | 5962-01-451-4530 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 MULTIPLEXER |
| INCLOSURE CONFIGURATION | FLAT PACK |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL INPUT |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | 16 X 16 MULTIPLEXER |
| END ITEM IDENTIFICATION | JOINT STRS RD E/I FSCM 67268 |
| TERMINAL TYPE AND QUANTITY | 64 FLAT LEADS |