The SEMICONDUCTOR DEVICES,UNITIZED is a the manufacturer industrial component. Key specifications include material: CERAMIC AND GLASS ENCLOSURE, overall_width: 0.310 INCHES MAXIMUM IN, overall_height: 0.160 INCHES MAXIMUM IN, overall_length: 0.785 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 0.188 INCHES NOMINAL IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-01-170-0111, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | CERAMIC AND GLASS ENCLOSURE |
| overall_width | 0.310 INCHES MAXIMUM IN |
| overall_height | 0.160 INCHES MAXIMUM IN |
| overall_length | 0.785 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 0.188 INCHES NOMINAL IN |
| special_features | ALL TRANSISTOR JUNCTION PATTERN ARRANGEMENT: NPN |
| features_provided | HERMETICALLY SEALED CASE |
| semiconductor_material | SILICON ALL TRANSISTOR |
| terminal_type_and_quantity | 14 PRINTED CIRCUIT |
| component_name_and_quantity | 5 TRANSISTOR |
| power_rating_per_characteristic | 300.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION ALL TRANSISTOR |
| NSN | 5961-01-170-0111 |
| MATERIAL | CERAMIC AND GLASS ENCLOSURE |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 CELSIUS JUNCTION DEGC |
| SPECIAL FEATURES | ALL TRANSISTOR JUNCTION PATTERN ARRANGEMENT: NPN |
| TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |
| TERMINAL LENGTH | 0.188 INCHES NOMINAL IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MOUNTING METHOD | TERMINAL |
| OVERALL WIDTH | 0.310 INCHES MAXIMUM IN |
| OVERALL LENGTH | 0.785 INCHES MAXIMUM IN |
| COMPONENT NAME AND QUANTITY | 5 TRANSISTOR |