LM108AF: MICROCIRCUIT,LINEAR.
The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.030 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, body_length: 0.290 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND HERMETICALLY SEALED, inclosure_material: SILICON, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-062-0029, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| body_height | 0.030 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN |
| body_length | 0.290 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC AND HERMETICALLY SEALED |
| inclosure_material | SILICON |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 6 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| design_function_and_quantity | 1 AMPLIFIER, OPERATIONAL, LINEAR |
| maximum_power_dissipation_rating | 500.0 MILLIWATTS |
| NSN | 5962-01-062-0029 |
| INPUT CIRCUIT PATTERN | 6 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | TIN |
| BODY WIDTH | 0.240 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.030 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND EXTERNALLY COMPENSATED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS |
| INCLOSURE CONFIGURATION | FLAT PACK |
| BODY LENGTH | 0.270 INCHES MINIMUM AND 0.290 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |