LH0101AK/883B: MICROCIRCUIT,LINEAR.
The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 1.050 INCHES MAXIMUM IN, body_height: 0.450 INCHES MAXIMUM IN, body_length: 1.573 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND W/RESISTOR AND INTERNALLY COMPENSATED, inclosure_material: METAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-213-7452, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 1.050 INCHES MAXIMUM IN |
| body_height | 0.450 INCHES MAXIMUM IN |
| body_length | 1.573 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND W/RESISTOR AND INTERNALLY COMPENSATED |
| inclosure_material | METAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 3 INPUT |
| inclosure_configuration | CAN |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 8 FLAT LEADS |
| NSN | 5962-01-213-7452 |
| INCLOSURE MATERIAL | GLASS OR METAL OR CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER OR TIN |
| DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE |
| FEATURES PROVIDED | HERMETICALLY SEALED |
| INCLOSURE CONFIGURATION | CAN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |