The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_height: 0.125 INCHES MINIMUM AND 0.145 INCHES MAXIMUM IN, overall_height: 0.665 INCHES MINIMUM IN, features_provided: MONOLITHIC AND HIGH PERFORMANCE AND BURN IN, MIL-STD-883, CLASS B, precious_material: GOLD, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-081-8324, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_height | 0.125 INCHES MINIMUM AND 0.145 INCHES MAXIMUM IN |
| overall_height | 0.665 INCHES MINIMUM IN |
| features_provided | MONOLITHIC AND HIGH PERFORMANCE AND BURN IN, MIL-STD-883, CLASS B |
| precious_material | GOLD |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| body_outside_diameter | 0.305 INCHES MINIMUM AND 0.335 INCHES MAXIMUM IN |
| input_circuit_pattern | 2 INPUT |
| end_item_identification | ACFT MODEL H-3 |
| inclosure_configuration | CAN |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-081-8324 |
| INCLOSURE MATERIAL | GLASS AND METAL |
| TERMINAL TYPE AND QUANTITY | 8 PIN |
| TERMINAL SURFACE TREATMENT | SOLDER |
| MAXIMUM POWER DISSIPATION RATING | 670.0 MILLIWATTS |
| BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS |
| DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE |
| TIME RATING PER CHACTERISTIC | 4000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| INPUT CIRCUIT PATTERN | 2 INPUT |