The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, features_provided: HIGH SPEED AND MONOLITHIC AND W/CLOCK AND W/RESET, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-235-6970, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.140 INCHES MAXIMUM IN |
| body_length | 0.840 INCHES MAXIMUM IN |
| features_provided | HIGH SPEED AND MONOLITHIC AND W/CLOCK AND W/RESET |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 2 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-235-6970 |
| BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.140 INCHES MAXIMUM IN |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| FEATURES PROVIDED | HIGH SPEED AND MONOLITHIC AND W/CLOCK AND W/RESET |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |