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L537111336 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

L537111336: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.510 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN, body_height: 0.225 INCHES MAXIMUM IN, body_length: 2.096 INCHES MAXIMUM IN, overall_width: 0.590 INCHES MINIMUM AND 0.630 INCHES MAXIMUM IN, features_provided: BIDIRECTIONAL AND BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED AND ULTRAVIOLET ERASABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-341-7952, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
L537111336
NSN: 5962-01-341-7952
FSC: 5962 — Microcircuits, Electronic
CAGE: 36090 — LOCKHEED MARTIN LIBRASCOPE CORPORATION (USA)
SPECIFICATIONS
body_width0.510 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN
body_height0.225 INCHES MAXIMUM IN
body_length2.096 INCHES MAXIMUM IN
overall_width0.590 INCHES MINIMUM AND 0.630 INCHES MAXIMUM IN
features_providedBIDIRECTIONAL AND BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED AND ULTRAVIOLET ERASABLE
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePROGRAMMED
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern38 INPUT
inclosure_configurationDUAL-IN-LINE
NSN5962-01-341-7952
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN L537111336 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 38 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.510 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.225 INCHES MAXIMUM IN
•
FEATURES PROVIDED: BIDIRECTIONAL AND BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED AND ULTRAVIOLET ERASABLE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN38 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.510 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN
BODY HEIGHT0.225 INCHES MAXIMUM IN
OVERALL WIDTH0.590 INCHES MINIMUM AND 0.630 INCHES MAXIMUM IN
FEATURES PROVIDEDBIDIRECTIONAL AND BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED AND ULTRAVIOLET ERASABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEPROGRAMMED
CASE OUTLINE SOURCE AND DESIGNATORD-5 MIL-M-38510
SUBSTITUTES & CROSS-REFERENCES 2
5962-8854801QAReference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is L537111336?
L537111336 is a MICROCIRCUIT,MEMORY.
What parts can replace L537111336?
There are 2 known substitutes for L537111336: 5962-8854801QA, ROM/PROM. Substitute compatibility should be verified for your specific system.
What is the NSN for L537111336?
L537111336 is cataloged in the U.S. Government catalog under NSN 5962-01-341-7952. This indicates validated use in U.S. government and defense supply chains.
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