L537001018 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

L537001018: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.600 INCHES NOMINAL IN, body_height: 0.265 INCHES MAXIMUM IN, body_length: 1.600 INCHES NOMINAL IN, bit_quantity: 1048576, word_quantity: 131072, overall_height: 0.415 INCHES NOMINAL IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-341-4320, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

L537001018

NSN: 5962-01-341-4320
FSC: 5962 — Microcircuits, Electronic
CAGE: 36090 — LOCKHEED MARTIN LIBRASCOPE CORPORATION (USA)

SPECIFICATIONS

body_width	0.600 INCHES NOMINAL IN
body_height	0.265 INCHES MAXIMUM IN
body_length	1.600 INCHES NOMINAL IN
bit_quantity	1048576
word_quantity	131072
overall_height	0.415 INCHES NOMINAL IN
features_provided	HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND ELECTROSTATIC SENSITIVE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
NSN	5962-01-341-4320

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 1048576

•

INPUT CIRCUIT PATTERN: 28 INPUT

•

WORD QUANTITY: 131072

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.600 INCHES NOMINAL IN

•

BODY HEIGHT: 0.265 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	1048576
OVERALL HEIGHT	0.415 INCHES NOMINAL IN
INPUT CIRCUIT PATTERN	28 INPUT
WORD QUANTITY	131072
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.600 INCHES NOMINAL IN
BODY HEIGHT	0.265 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	DUAL-IN-LINE

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

EDI8M8128P120CBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — stock exhausted; no further procurementDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is L537001018?

L537001018 is a MICROCIRCUIT,MEMORY.

What parts can replace L537001018?

There is 1 known substitute for L537001018: EDI8M8128P120CB. Substitute compatibility should be verified for your specific system.

What is the NSN for L537001018?

L537001018 is cataloged in the U.S. Government catalog under NSN 5962-01-341-4320. This indicates validated use in U.S. government and defense supply chains.

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