L537-111-103 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

L537-111-103: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.599 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, body_length: 1.435 INCHES MINIMUM AND 1.485 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE AND BIDIRECTIONAL AND ELECTROSTATIC SENSITIVE, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-287-8530, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

L537-111-103

NSN: 5962-01-287-8530
FSC: 5962 — Microcircuits, Electronic
CAGE: 36090 — LOCKHEED MARTIN LIBRASCOPE CORPORATION (USA)

SPECIFICATIONS

body_width	0.515 INCHES MINIMUM AND 0.599 INCHES MAXIMUM IN
body_height	0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
body_length	1.435 INCHES MINIMUM AND 1.485 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE AND BIDIRECTIONAL AND ELECTROSTATIC SENSITIVE
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	25 INPUT
NSN	5962-01-287-8530

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 25 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.515 INCHES MINIMUM AND 0.599 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE AND BIDIRECTIONAL AND ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	25 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.515 INCHES MINIMUM AND 0.599 INCHES MAXIMUM IN
BODY HEIGHT	0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE AND BIDIRECTIONAL AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.435 INCHES MINIMUM AND 1.485 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROM FAMILY 040Reference document

Same NSN cross-reference

Reference document — Secondary reference

DM2764-250Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is L537-111-103?

L537-111-103 is a MICROCIRCUIT,MEMORY.

What parts can replace L537-111-103?

There are 2 known substitutes for L537-111-103: ROM/PROM FAMILY 040, DM2764-250. Substitute compatibility should be verified for your specific system.

What is the NSN for L537-111-103?

L537-111-103 is cataloged in the U.S. Government catalog under NSN 5962-01-287-8530. This indicates validated use in U.S. government and defense supply chains.

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