L537 300 124 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

L537 300 124: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.610 INCHES MAXIMUM IN, body_height: 0.150 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, overall_height: 0.345 INCHES MINIMUM AND 0.425 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: MONOLITHIC AND SCHOTTKY AND BIPOLAR. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-234-2133, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

L537 300 124

NSN: 5962-01-234-2133
NIINs: 012342133, 012343572, 012343573, 012345205, 013303270, 013305528, 013305529, 013305530
FSC: 5962 — Microcircuits, Electronic
CAGE: 36090 — LOCKHEED MARTIN LIBRASCOPE CORPORATION (USA)

SPECIFICATIONS

body_width	0.610 INCHES MAXIMUM IN
body_height	0.150 INCHES MAXIMUM IN
body_length	1.290 INCHES MAXIMUM IN
overall_height	0.345 INCHES MINIMUM AND 0.425 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	MONOLITHIC AND SCHOTTKY AND BIPOLAR
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-234-2133

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 13 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.610 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.205 INCHES NOMINAL IN

•

FEATURES PROVIDED: BIPOLAR AND PROGRAMMABLE AND SCHOTTKY

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	13 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.610 INCHES MAXIMUM IN
BODY HEIGHT	0.205 INCHES NOMINAL IN
FEATURES PROVIDED	BIPOLAR AND PROGRAMMABLE AND SCHOTTKY
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
CASE OUTLINE SOURCE AND DESIGNATOR	D-3 MIL-M-38510
BODY LENGTH	1.290 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 3

ROM/PROM FAMILY 026Reference document

Same NSN cross-reference

Reference document — Secondary reference

M38510/20802BJBReference document

Same NSN cross-reference

Reference document — Secondary reference

L537111054Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — mutilation

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FREQUENTLY ASKED QUESTIONS

What is L537 300 124?

L537 300 124 is a MICROCIRCUIT,MEMORY.

What parts can replace L537 300 124?

There are 3 known substitutes for L537 300 124: ROM/PROM FAMILY 026, M38510/20802BJB, L537111054. Substitute compatibility should be verified for your specific system.

What is the NSN for L537 300 124?

L537 300 124 is cataloged in the U.S. Government catalog under NSN 5962-01-234-2133. This indicates validated use in U.S. government and defense supply chains.

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