L537 000 863 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

L537 000 863: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 1.360 INCHES MAXIMUM IN, body_height: 0.385 INCHES MAXIMUM IN, body_length: 1.470 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND POSITIVE OUTPUTS AND W/SENSOR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-290-5706, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

L537 000 863

NSN: 5962-01-290-5706
FSC: 5962 — Microcircuits, Electronic
CAGE: 36090 — LOCKHEED MARTIN LIBRASCOPE CORPORATION (USA)

SPECIFICATIONS

body_width	1.360 INCHES MAXIMUM IN
body_height	0.385 INCHES MAXIMUM IN
body_length	1.470 INCHES MAXIMUM IN
special_features	MICROCIRCUIT MEMORY,BUBBLE,MEGABIT,ONE WITH 1 BRACKET,HEAT SENSOR,ASSEMBLY,1 HEATER,ELECTRICAL,1 SWITCH,THERMO,1 INSULATOR,HEATER,AND 1 BRACKET,THERMAL SWITCH
features_provided	HERMETICALLY SEALED AND BURN IN AND POSITIVE OUTPUTS AND W/SENSOR
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-55.0 TO 100.0 CELSIUS DEGC
operating_temp_range	-20.0 TO 85.0 CELSIUS DEGC
input_circuit_pattern	13 INPUT
end_item_identification	7010-01-211-9822
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-290-5706

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 13 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 1.360 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.385 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND POSITIVE OUTPUTS AND W/SENSOR

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

BODY LENGTH: 1.470 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	13 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	1.360 INCHES MAXIMUM IN
BODY HEIGHT	0.385 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND POSITIVE OUTPUTS AND W/SENSOR
INCLOSURE CONFIGURATION	DUAL-IN-LINE
BODY LENGTH	1.470 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-55.0 TO 100.0 CELSIUS DEGC
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

B4043604Reference document

Same NSN cross-reference

Reference document — Secondary reference

L537 000 735Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is L537 000 863?

L537 000 863 is a MICROCIRCUIT,MEMORY.

What parts can replace L537 000 863?

There are 2 known substitutes for L537 000 863: B4043604, L537 000 735. Substitute compatibility should be verified for your specific system.

What is the NSN for L537 000 863?

L537 000 863 is cataloged in the U.S. Government catalog under NSN 5962-01-290-5706. This indicates validated use in U.S. government and defense supply chains.

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L537 000 863 — MICROCIRCUIT,MEMORY

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