L2088570-2: SOCKET,PLUG-IN ELECTRONIC COMPON.
SOCKET,PLUG-IN ELECTRONIC COMPON. Key specifications include material: COPPER ALLOY CONTACT, precious_material: SILVER, surface_treatment: SILVER CONTACT, fabrication_method: MOLDED, mounting_hole_style: SLOT FOUR MOUNTING HOLES/SLOTS ON BOLT CIRCLE, mounting_hole_diameter: 0.065 INCHES NOMINAL IN. This part is cataloged in the U.S.
Government catalog under NSN 5935-00-771-8353, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | COPPER ALLOY CONTACT |
| precious_material | SILVER |
| surface_treatment | SILVER CONTACT |
| fabrication_method | MOLDED |
| mounting_hole_style | SLOT FOUR MOUNTING HOLES/SLOTS ON BOLT CIRCLE |
| mounting_hole_diameter | 0.065 INCHES NOMINAL IN |
| terminal_type_and_quantity | 4 SOLDER STUD |
| precious_material_and_weight | 0.020 SILVER GRAINS, TROY |
| accommodated_contact_quantity | 4 |
| mounting_bolt_circle_diameter | 0.200 INCHES NOMINAL IN |
| precious_material_and_location | CONTACT SURFACES SILVER |
| specific_equipment_accommodated | SEMICONDUCTOR DEVICE |
| NSN | 5935-00-771-8353 |
| MOUNTING HOLE STYLE | SLOT FOUR MOUNTING HOLES/SLOTS ON BOLT CIRCLE |
| ACCOMMODATED CONTACT QUANTITY | 4 |
| PRECIOUS MATERIAL | SILVER |
| SPECIFIC EQUIPMENT ACCOMMODATED | SEMICONDUCTOR DEVICE |
| PRECIOUS MATERIAL AND WEIGHT | 0.020 SILVER GRAINS, TROY |
| MOUNTING HOLE DIAMETER | 0.065 INCHES NOMINAL IN |
| CONTACT POSITION ARRANGEMENT STYLE | CIRCULAR |
| MOUNTING BOLT CIRCLE DIAMETER | 0.200 INCHES NOMINAL IN |
| SURFACE TREATMENT | SILVER CONTACT |
| MOUNTING TYPE FOR WHICH DESIGNED | CHASSIS |
No substitute or cross-reference records for this part.