L1A0474: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: ELECTROSTATIC SENSITIVE, inclosure_material: CERAMIC, memory_device_type: PAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: +0.0 TO 105.0 CELSIUS DEGC, inclosure_configuration: LEADLESS FLAT PACK. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-314-4870, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| features_provided | ELECTROSTATIC SENSITIVE |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | +0.0 TO 105.0 CELSIUS DEGC |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 148 LEADLESS |
| maximum_power_dissipation_rating | 2.0 WATTS |
| current_rating_per_characteristic | 9.00 MILLIAMPERES MAXIMUM SUPPLY |
| voltage_rating_and_type_per_characteristic | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| NSN | 5962-01-314-4870 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CURRENT RATING PER CHARACTERISTIC | 9.00 MILLIAMPERES MAXIMUM SUPPLY |
| MEMORY DEVICE TYPE | PAL |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| OPERATING TEMP RANGE | +0.0 TO 105.0 CELSIUS DEGC |
| TERMINAL TYPE AND QUANTITY | 148 LEADLESS |